DSPIC33FJ09GS302T-E/MM

IC MCU 16BIT 9KB FLASH 28QFN

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Specifications
Part Number:DSPIC33FJ09GS302T-E/MM
Manufacturer:Micrel / Microchip Technology
Description:IC MCU 16BIT 9KB FLASH 28QFN
RoHs Status:
Nkesp Part Number:73D-DSPIC33FJ09GS302T-E/MM
Part Status3984 pcs
Manufacturer:Micrel / Microchip Technology
Voltage - Supply (Vcc/Vdd):3V ~ 3.6V
Supplier Device Package:28-QFN-S (6x6)
Speed:40 MIPs
Series:Automotive, AEC-Q100, dsPIC™ 33F
RAM Size:1K x 8
Program Memory Type:FLASH
Program Memory Size:9KB (3K x 24)
Peripherals:Brown-out Detect/Reset, POR, PWM, WDT
Package / Case:28-VQFN Exposed Pad
Package:Tape & Reel (TR)
Oscillator Type:Internal
Operating Temperature:-40°C ~ 125°C (TA)
Number of I/O:21
Mounting Type:Surface Mount
EEPROM Size:-
Data Converters:A/D 8x10b; D/A 2x10b
Core Size:16-Bit
Core Processor:dsPIC
Connectivity:I²C, IrDA, LINbus, SPI, UART/USART
Base Product Number:DSPIC33FJ09GS302
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In stock: 3984 pcs

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Product Comparison

Part Number DSPIC33FJ09GS302T-E/MM
DSPIC33FJ09GS302T-E/MM
DSPIC33FJ09GS302T-E/TL
DSPIC33FJ09GS302T-E/TL
DSPIC33FJ09GS302T-I/SO
DSPIC33FJ09GS302T-I/SO
DSPIC33FJ09GS302-I/TL
DSPIC33FJ09GS302-I/TL
ManufacturerMicrochip TechnologyMicrochip TechnologyMicrochip TechnologyMicrochip Technology
Program Memory TypeFLASHFLASHFLASHFLASH
PackageTape & Reel (TR)Tape & Reel (TR)Tape & Reel (TR)Tube
Core ProcessordsPICdsPICdsPICdsPIC
RAM Size1K x 81K x 81K x 81K x 8
EEPROM Size----
Number of I/O21212121
Base Product NumberDSPIC33FJ09GS302DSPIC33FJ09GS302DSPIC33FJ09GS302DSPIC33FJ09GS302
Speed40 MIPs40 MIPs40 MIPs40 MIPs
Mounting TypeSurface MountSurface MountSurface MountSurface Mount
Voltage - Supply (Vcc/Vdd)3V ~ 3.6V3V ~ 3.6V3V ~ 3.6V3V ~ 3.6V
SeriesAutomotive, AEC-Q100, dsPIC™ 33FAutomotive, AEC-Q100, dsPIC™ 33FdsPIC™ 33FdsPIC™ 33F
PeripheralsBrown-out Detect/Reset, POR, PWM, WDTBrown-out Detect/Reset, POR, PWM, WDTBrown-out Detect/Reset, POR, PWM, WDTBrown-out Detect/Reset, POR, PWM, WDT
Oscillator TypeInternalInternalInternalInternal
Data ConvertersA/D 8x10b; D/A 2x10bA/D 8x10b; D/A 2x10bA/D 8x10b; D/A 2x10bA/D 8x10b; D/A 2x10b
Operating Temperature-40°C ~ 125°C (TA)-40°C ~ 125°C (TA)-40°C ~ 85°C (TA)-40°C ~ 85°C (TA)
Supplier Device Package28-QFN-S (6x6)36-VTLA (5x5)28-SOIC36-VTLA (5x5)
Program Memory Size9KB (3K x 24)9KB (3K x 24)9KB (3K x 24)9KB (3K x 24)
Package / Case28-VQFN Exposed Pad36-VFTLA Exposed Pad28-SOIC (0.295", 7.50mm Width)36-VFTLA Exposed Pad
ConnectivityI²C, IrDA, LINbus, SPI, UART/USARTI²C, IrDA, LINbus, SPI, UART/USARTI²C, IrDA, LINbus, SPI, UART/USARTI²C, IrDA, LINbus, SPI, UART/USART
Core Size16-Bit16-Bit16-Bit16-Bit

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